BGA Reballing: Everything You Need To Know

Almost everyone makes consistent usage of a certain product. Most of us, for instance, have access to and make frequent use of automobiles. In addition, some of us employ specialized equipment, like modified computers or hand tools, for our jobs. The more frequently something is used, the more likely it is that it will require some sort of upkeep or repair. Similarly, Ball Grid Arrays (BGAs) need a BGA reballing method for rework in the future.

Reballing: Overview 

A Ball Grid Array (BGA) circuit board, designed by an engineer, is used to ensure a proper connection between the printed circuit board (PCB) and the chip. In order to get more use out of a BGA chip with an antiquated ball joint, industries may have to reconstruct older ball joints.

In most cases, the old solder balls will need to be scraped off and replaced. Video graphics processors are the most common cause of reballing on gaming systems, laptops, and PC motherboards.

VGCs are sometimes described as “unlucky” in the industry due to their tendency for solder joint breakdown and the requirement for repeated repairs over their lifespan. Even the most cutting-edge BGA circuit chips will eventually need reballing for a variety of reasons.

What Effect Do Weak Solder Joints Have On Efficiency?

As you watch a movie or play a game on your laptop or console, you may notice that the screen goes black. Inadequate soldering is a common culprit in the “blank screen of death.” 

Lines or spots on the screen could be horizontal or vertical, indicating poor solder joints. Because of this, the computer may require BGA reballing before it will boot normally.

Why Does a BGA Circuit May Require Rebalance?

The first is that it’s just been used to death. After several days of heavy use, a graphics chip may require reballing of its BGA package. After some time, the connection between the printed circuit board and the chip may become dislodged. As a result, users may notice worsening display issues over time.

There is a risk that BGA chips will malfunction, requiring a replacement shipment from the manufacturer. Depending on the new features of the program, upgrading the BGA chips on a PCB chipset may also be necessary.

An overheated BGA chip may also necessitate reballing. If chips are allowed to become too hot, the solder ball could melt and migrate across the board. In the absence of a solder connection, the solder could still cause your computer to completely freeze or crash.

How does BGA reballing work?

The exact method used by each BGA reballing company varies, however, there are several universal steps that are always taken. The four main steps in any BGA repair or reballing process are module removal, component cleaning, deballing, and reballing. The following procedures are customary for reballing a BGA:

• Press down on the BGA when the solder becomes pliable enough to be lifted.
• In order to get rid of the solder balls off the circuit board, you’ll need to use a soldering iron.
• To remove solder from the surface of a printed circuit board, you should use isopropyl alcohol.
• Put some flux paste on the printed circuit board. Both solder paste flux and jelly are made of chemicals. It may improve the efficiency of liquid soldering by removing oxidation from the surface of metals before soldering.
• Coat the PCB in solder and set the solder balls in position.
• The component should be fully reassembled and placed back into a repair or reflow oven.

BGA Reballing Instruments That Are Typically Employed

• Heating Tool for Soldering

For soldering, you’ll need a soldering iron, which is a special type of hand tool. Soldering melts the metal into the cracks between the PCB and the electronic components. Insulated at the handle and tip, soldering irons are used to join metal parts together.

• Soldering Paste

When creating printed circuit boards, manufacturers frequently use solder paste to connect surface-mounted components to corresponding pads. Therefore, it substantially facilitates soldering and the attachment of electrical components.

• Using Wire to Remove Solder

Desoldering wire, also known as 18- to the 42-gauge copper wire that has been braided and coated with Rosin Flux, can be purchased on a sheet at your neighborhood electronics retailer. If you need to get rid of solder from a solder connection, use this desoldering wire to sponge up the metal.

• BGA Chip Housing

A standard chip holder, its sole purpose is to facilitate reballing.

• Stencils for BGA Chips

A Chip Stencil is a metal sheet with numerous holes in it to hold Solder Balls. Since its primary material is metal, the Soldering ball can be heated instantly using a hot air gun or BGA machinery, speeding up the process and making it easier to use.

• Solder Balls

Solder balls, which are little spheres used to attach components to surface-mount technology (SMT) board, are exactly what their name implies. Solder balls are typically used to attach chip packages to a Printed Circuit Board (PCB) and to interconnect many chip packages in a circuit board module.

• BGA Rework Machine

It’s a hot piece of machinery that’s mostly employed for soldering or desoldering BGA chips.